Power Electronics, Measurements and Design
email us: contact@athenaenergycorp.com

Publications from Athena Energy Authors

There are a lot of papers from Athena Energy on topics from reliability to power module fabrication. We are sure you will find them useful in your research. Feel free to contact us: contact@athenaenergycorp.com for details.

Works by Athena Energy Authors:

  • D.C. Katsis, “Film Capacitor Reliability in PV Inverters” (ASME IMECE 2009)
  • D.C. Katsis, Reliability Assessment for the bypass diode in a PV module (Presentation)
  • D.C. Katsis and Y. Zheng, “High Temperature Encapsulant Study” Conference proceedings of IMAPS 2007 : (IMAPS 2007)
  • D.C. Katsis and Y. Zheng, “High Temperature Power Semiconductor Module for Extreme Environments” (PESC 2008)
  • Katsis D. C. ; vanWyk J. D. ; “A Thermal, Mechanical, and Electrical Study of Voiding in the Solder Die-Attach of Power MOSFETs” IEEE Transactions on Components and Packaging Technologies :
  • Katsis, D.; Geil, B.; Griffin, T.; Koebke, G.; Kaplan, S.; Ovrebo, G.; Bayne, S.; “Silicon carbide power semiconductor module development for a high temperature 10kW AC drive” Industry Applications Conference, 2005. Conference Record of the Fourtieth IAS Annual Meeting. 2005, Volume 1, 2-6 Oct. 2005 Page(s):399 – 403
  • Katsis, D.; Wheeler, P.W.; Clare, J.C.; Empringham, L.; Bland, M.; “A utility power supply based on a four-output leg matrix converter” Industry Applications Conference, 2005. . Conference Record of the Fourtieth IAS Annual Meeting 2005, Volume 4, 2-6 Oct., 2005 Page(s):2355 – 2359
  • Podlesak, T.F.; Katsis, D.C.; Wheeler, P.W.; Clare, J.C.; Empringham, L.; Bland, M.; “A 150-kVA Vector-Controlled Matrix Converter Induction Motor Drive” IEEE Transactions on Industry Applications, Volume 41, Issue 3, May-June 2005 Page(s):841 – 847
  • D. C. Katsis, J.D. vanWyk, “Void Induced Thermal Impedance in Power Semiconductor Modules: Some Transient Temperature Effects”, Transactions of the IEEE Industry Applications Society, Volume: 39 , Issue: 5 , Sept.-Oct. 2003, pp:1239 – 1246
  • D.C. Katsis, J.D. vanWyk, “A finite element modeling of dynamic hot spot effects in MOSFET dies due to voiding in the solder die-attach”, IEEE 34th Annual Conference of Power Electronics Specialists 2003. June 2003, vol.2. pp: 828 – 833

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